Features产品特点：
• Compatible with leadfree solders and higher temperature profiles.
• High performance materials provide improved performance in elevated ambient temperature applications.
• Marked on top surface with code to allow amp rating identification without testing.
• Low profile for height sensitive applications.
• Flat top surface for pickand-place operations.
• Element covering material is resistant to industry standard cleaning operations.
• Mounting pad and electrical performance is identical to Littelfuse 431 and 434 Series products.
• Alloy based element construction provides superior inrush withstand characteristics (I2t) over ceramic or glass based 0603 fuse products.
Applications产品应用：
Secondary protection for space constrained applications:
• Cell phones • Battery packs
• Digital cameras • DVD players • Hard disk drives.
Electrical Characteristics for Series | ||
% of Ampere Rating | Opening Time at 25OC | |
100% | 0.25-8A | 4 hours, Minimum |
200% | 0.25-6A | 5 sec., Maximum |
250% | 7-8A | 5 sec., Maximum |
300% | 0.25-8A | 0.2 sec., Maximum |
Electrical Specifications by Item
1. Measured at 10% of rated current, 25ºC. 2. Measured at rated voltage.
Temperature Rerating Curve
Note:
1. Derating depicted in this curve is in addition to the standard derating of 25% for
continuous operation.
Example:For continuous operation at 70 degrees celsius, the fuse should be deratedas follows:
I = (0.75)(0.80)IRAT = (0.60)IRAT
2. The temperature derating curve represents the nominal conditions. For questions about temperature derating curve, please consult Littelfuse technical support for assistance.
Average Time Current Curves
Soldering Parameters
| Reflow Condition | Pb– Free assembly | |
| Pre Heat | Temperature Min (Ts(min)) | 150°C |
| Temperature Max (Ts(max)) | 200°C | |
| Time (Min to Max) (ts) | 60 – 180 secs | |
| Average ramp up rate (Liquidus Temp(TL) to peak | 5°C/second max | |
| TS(max) to TL-Ramp-up Rate | 5°C/second max | |
| Reflow | Temperature (TL) (Liquidus) | 217°C |
| Temperature (tL) | 60 – 150 seconds | |
| Peak Temperature (TP) | 250+0/-5 °C | |
| Time within 5°C of actual peak Temperature (tp) | 20 – 40 seconds | |
| Ramp-down Rate | 5°C/second max | |
| Time 25°C to peak Temperature (TP) | 8 minutes Max. | |
| Do not exceed | 260°C | |
| Wave Soldering | 260°C, 10 seconds max. | |
Product Characteristics
| Materials | Body: Advanced High Temperature Substrate |
| Terminations: 100% Tin over Nickel over Copper | |
| Element Cover Coat: Conformal Coating | |
| Operating Temperature | – 55OC to 90OC. Consult temperature rerating curve chart. For operation above 90°C contact us |
| Humidity | MIL-STD-202F, Method 103B, Condition D |
| Thermal Shock | Withstands 5 cycles of – 55OC to 125OC |
| Vibration | Per MIL-STD-202F |
| Insulation Resistance (After Opening) | Greater than 10,000 ohms. |
| Resistance to Soldering Heat | MIL-STD-202G, Method 210F,Condition D |
Dimensions
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